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<Article>
<Journal>
				<PublisherName>University of Kashan</PublisherName>
				<JournalTitle>Journal of Nanostructures</JournalTitle>
				<Issn>2251-7871</Issn>
				<Volume>15</Volume>
				<Issue>1</Issue>
				<PubDate PubStatus="epublish">
					<Year>2025</Year>
					<Month>01</Month>
					<Day>01</Day>
				</PubDate>
			</Journal>
<ArticleTitle>New Approach to in situ Chemical Vapor Deposition-Grown Graphene reinforced Copper Matrix for Increasing Electrical Conductivity and Mechanical Properties</ArticleTitle>
<VernacularTitle></VernacularTitle>
			<FirstPage>134</FirstPage>
			<LastPage>149</LastPage>
			<ELocationID EIdType="pii">114745</ELocationID>
			
<ELocationID EIdType="doi">10.22052/JNS.2025.01.013</ELocationID>
			
			<Language>EN</Language>
<AuthorList>
<Author>
					<FirstName>Misagh</FirstName>
					<LastName>Alaie Faradonbeh</LastName>
<Affiliation>Nanotechnology Research Center, Research Institute of Petroleum Industry, Tehran, Iran</Affiliation>

</Author>
<Author>
					<FirstName>Alimorad</FirstName>
					<LastName>Rashidi</LastName>
<Affiliation>Nanotechnology Research Center, Research Institute of Petroleum Industry, Tehran, Iran</Affiliation>

</Author>
<Author>
					<FirstName>Zohal</FirstName>
					<LastName>Safaei Mahmoudabadi</LastName>
<Affiliation>Nanotechnology Research Center, Research Institute of Petroleum Industry, Tehran, Iran</Affiliation>

</Author>
<Author>
					<FirstName>Fatemeh</FirstName>
					<LastName>Dodangeh</LastName>
<Affiliation>Department of Chemistry, Science and Research Branch, Islamic Azad University, Tehran, Iran</Affiliation>

</Author>
</AuthorList>
				<PublicationType>Journal Article</PublicationType>
			<History>
				<PubDate PubStatus="received">
					<Year>2024</Year>
					<Month>09</Month>
					<Day>21</Day>
				</PubDate>
			</History>
		<Abstract>The chemical compatibility and successful formation of morphology of graphene sheet growth on the copper matrix were investigated with scanning electron microscope (SEM) techniques, transmission electron microscopy (TEM), EDS and mapping analysis tests, RAMAN spectroscopy, X-ray diffraction (XRD). Also, the effects of individual process variables such as 0 to 900 cc/min methane gas flow rate, 0 to 45 minutes, and 1000 °C are used in CVD method to grow the graphene on Cu substrate and as a result of electrical conductivity  and mechanical properties were evaluated for different outcomes samples in this reasearch. The results revealed to the optimum values for Cu powder/Gr nanocomposite samples were found at 300 cc/min methane flow rate during 45 minutes at 1000 °C, as well as 0.2 mm thickness of Cu wire in the same condition which led these samples to high electrical conductivity, and high hardness rather than Cu pure. The great instruction of graphene growth design and morphology is the cause for increasing electron mobility in the Cu/graphene nanocomposites. As a result, the electrical conductivity of the Cu/Gr nanocomposites is three times higher than the counterpart without graphene growth. Also, the outcomes of this research were found the highest amount of electrical conductivity and hardness value of Cu/Gr nanocomposite are more than other Cu/Gr composites. This study provides a new approach for modification Cu substrate by growth graphene using CVD method in order to high electrical conductivity and high mechanical properties.</Abstract>
		<ObjectList>
			<Object Type="keyword">
			<Param Name="value">Chemical Vapor Deposition (CVD)</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">Copper-graphene nanocomposites</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">Copper wire</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">Electrical conductivity</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">graphene</Param>
			</Object>
			<Object Type="keyword">
			<Param Name="value">Mechanical properties</Param>
			</Object>
		</ObjectList>
<ArchiveCopySource DocType="pdf">https://jns.kashanu.ac.ir/article_114745_fd9c2edc01f72c562b961495cdc02152.pdf</ArchiveCopySource>
</Article>
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